Abstract
A cost-effective 25 Gbit/s directly modulated transmitter optical
sub-assembly (TOSA) employing transistor outline (TO)-CAN materials and
processes is demonstrated. A high speed distributed feedback laser diode
(DFB LD) chip used in the TOSA is characterized by a directly high frequency
probing measurement and an equivalent circuit model according to the
measurement result. Using a TOSA package with TO-CAN structure and applying
the deduced equivalent circuit model of the DFB LD chip in the simulation, a
modified TOSA is proposed. The parasitic effect of bonding-wire and the gap
induced in die bonding process is studied comprehensively to achieve an
optimum configuration. Based on the simulated result, the proposed TOSA is
fabricated through a conventional TO-CAN and TOSA fabrication process. The
measured results show that the TOSA exhibits a 3-dB bandwidth of 18.7 GHz
and a clearly opening eye diagram of 25 Gbit/s. This developed TOSA is
potential for use in the next generation fiber network of 25 Gbit/s or 100
Gbit/s due to advantages of cost-effective design and mass production
capability.
© 2012 IEEE
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