Abstract
The performance of relatively complex photonic integrated circuits (PICs)
is now reaching such high levels that the long sought goal of realizing
low-cost, –size, -weight, and -power chips to replace hybrid
solutions seems to have been achieved for some applications. This tutorial
traces some of the evolution of this technology that has led to an array of
high-functionality InP-based PICs useful in optical sensing and
communication applications. Examples of recent high-performance PICs that
have arisen out of these developments are presented.Fundamental to much of this work was the development of integration
strategies to compatibly combine a variety of components in a relatively
simple fabrication process. For the UCSB work, this was initially based upon
the creation of a single-chip widely tunable semiconductor laser that
required the integration of gain, reflector, phase-tuning and absorber
sections. As it provided most of the elements needed for many more complex
PICs, their creation followed somewhat naturally by adding more of these
same elements outside of the laser cavity using the same processing steps.
Of course, additional elements were needed for some of the PICs to be
discussed, but in most cases, these have been added without adding
significant processing complexity. Generally, the integration philosophy has
been to avoid patterned epitaxial growths, to use post-growth processing,
such as quantum-well intermixing to provide multiple bandgaps, rather than
multiple epitaxial regrowths, and to focus on processes that could be
performed with vendor growth and implant facilities so that only basic clean
room processing facilities are required.
© 2010 IEEE
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