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Optica Publishing Group
  • Journal of Lightwave Technology
  • Vol. 26,
  • Issue 2,
  • pp. 243-250
  • (2008)

Fully Embedded Board-Level Optical Interconnects From Waveguide Fabrication to Device Integration

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Abstract

This paper presents the latest progress toward fully embedded board-level optical interconnects in the aspect of waveguide fabrication and device integration. A one-step pattern transfer method is used to form a large cross-section multimode waveguide array with 45° micromirrors by silicon hard molding method. Optimized by a novel spin-coating surface smoothing method for the master mold, the waveguide propagation loss is reduced to 0.09 dB/cm. The coupling efficiency of the metal-coated reflecting mirror, which is embedded in the thin-film waveguide, is simulated by an M<sup>2</sup> factor revised Gaussian beam method and is experimentally measured to be 85%. The active optoelectronic devices, vertical surface emitter lasers and p-i-n photodiodes, are integrated with the mirror-ended waveguide array and successfully demonstrate a 10 Gbps signal transmission over the embeddable optical layer.

© 2008 IEEE

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